Local control of underfill flow on high density packages, packages and systems made therewith, and methods of making same

ABSTRACT

An article includes a mounting substrate, a passive component site on the mounting substrate, and an active component site on the mounting substrate. The article also includes a fluid flow barrier disposed local to the passive component site and spaced apart from the active component site. The fluid flow barrier can be a recess that resists fluid flow thereinto because of surface tension of the fluid when it meets-the recess edge. The fluid flow barrier can include a boundary that diverts fluid flow due to the angle of the recess edge as the fluid approaches it. An embodiment also includes a packaging system that includes the article and at least one passive component. An embodiment also includes a method of assembling the article or the packaging system.

TECHNICAL FIELD

Embodiments relate to a packaged semiconductive die with integratedcircuitry. More particularly, an embodiment relates to an underfillmaterial flow barrier that is local to a passive component.

BACKGROUND INFORMATION

The thermal stability of packaging compositions such as underfillmaterials or other organic encapsulation molding compounds, is importantin reducing the warpage of chip packages. Desirable materials haveproperties such as high thermal stability, low shrinkage, a favorablecoefficient of thermal expansion (CTE), and other qualities such as alow moisture uptake.

In chip packaging technology, the die is often bond-strengthened to themounting substrate with an organic material that is flowed into contactwith the die and the mounting substrate. In flip-chip processing, theorganic material flows between the die active surface and the mountingsubstrate, thus strengthening the bond therebetween, while protectingthe electrical contacts.

Some of the organic material invariably flows beyond the footprint ofthe die and onto the mounting substrate at the margins of the die. Theextent of this organic material flow, restricts the proximity ofelectrical contacts for passive components that are to be placed nearthe die, because the organic material can foul their contacts.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to understand the manner in which embodiments are obtained, amore particular description of various embodiments briefly describedabove will be rendered by reference to the appended drawings.Understanding that these drawings depict only typical embodiments thatare not necessarily drawn to scale and are not therefore to beconsidered to be limiting in scope, the embodiments will be describedand explained with additional specificity and detail through the use ofthe accompanying drawings in which:

FIG. 1 is a cross-section of a package that includes a fluid flowbarrier on a microstrip mounting substrate according to an embodiment;

FIG. 2 is a selective plan view of the microstrip mounting substratedepicted in FIG. 1 according to an embodiment;

FIG. 3 is a cross-section of a package that includes a fluid flowbarrier on a stripline mounting substrate according to an embodiment;

FIG. 4 is a plan of a passive component site detail taken from FIG. 3according to an embodiment;

FIG. 5 is a plan of a passive component site according to an embodiment;

FIG. 6 is a plan of a passive component site according to an embodiment;

FIG. 7 is a plan of a mounting substrate that includes an activecomponent site and a plurality of passive component sites according toan embodiment;

FIG. 8 is a plan of a mounting substrate that includes an activecomponent site and a plurality of passive component sites according toan embodiment;

FIG. 9 is a perspective cut-away of a computing system that includes thepackaging composition according to an embodiment; and

FIG. 10 is a process flow diagram that depicts a packaging processembodiment.

DETAILED DESCRIPTION

The following description includes terms, such as “upper”, “lower”,“first”, “second”, etc. that are used for descriptive purposes only andare not to be construed as limiting. The embodiments of a device orarticle described herein can be manufactured, used, or shipped in anumber of positions and orientations. The terms “die” and “processor”generally refer to the physical object that is the basic workpiece thatis transformed by various process operations into the desired integratedcircuit device. A die is usually singulated from a wafer, and wafers maybe made of semiconducting, non-semiconducting, or combinations ofsemiconducting and non-semiconducting materials. The term “chip” as usedherein refers to a die that has been encapsulated in an organic, aninorganic, or a combination organic and inorganic housing. A “board” istypically a resin-impregnated fiberglass structure that acts as amounting substrate for the chip.

FIG. 1 is a cross-section of a package 100 that includes a fluid flowbarrier on a microstrip mounting substrate according to an embodiment. Amounting substrate 110 for a microstrip board includes a solder mask 112that covers an electrical layer 114. In an embodiment, the electricallayer 114 includes a copper layer that has been patterned to include anactive component bond pad 116. The electrical layer 114 can also includea passive component bond pad 118. The electrical layer 114 can alsoinclude exposed conductive material that acts as a floor 120 in a fluidflow barrier according to an embodiment. Additionally, the electricallayer 114 can include traces 122, one of which is indicated in FIG. 1.

In an embodiment for a chip package, an active component 124, such as aprocessor or a memory chip, is bonded to the active component bond pad116 through a bump 126 according to an embodiment. The bump 126 isdepicted as a solder ball, but other electrical connections can be usedaccording to the specific application. Other electrical connectionsinclude bond wires bonded to the active component bond pad 116, leadfingers, pins, and others. According to an embodiment, a fluid flowbarrier 132 is coupled to the active component 124 by virtue of itsphysical disposition in relation thereto.

In an embodiment for a chip package, a passive component 128, such as acapacitor, an inductor, a resistor, or another passive component, isbonded to the passive component bond pad 118 through a bump 130according to an embodiment. The bump 130 is depicted as a lead finger,but other electrical connections can be used according to the specificapplication. Other electrical connections include bond wires bonded tothe passive component bond pad 118, solder balls, pins, and others.Similarly, according to an embodiment, the fluid flow barrier 132 iscoupled to the passive component 128 by virtue of its physicaldisposition in relation thereto.

FIG. 1 also depicts a fluid flow barrier 132, depicted in FIG. 1 as arecess 132 in the solder mask 112. The fluid flow barrier 132 can alsobe a dam according to an embodiment. The fluid flow barrier 132 can alsobe a recess in dam according to an embodiment. In any event, the fluidflow barrier 132 is disposed local to the passive component 128, andconsequently local to the passive component site as set forth in thisdisclosure. The floor 120 can be the dielectric of the mountingsubstrate 110, however, if no electrical layer 114 is present in therecess 132.

FIG. 1 also depicts an underfill material 134 that is illustrated ashaving filled the space between the active component 124 and themounting substrate 110 to insulate and protect the bump 126. FIG. 1 alsodepicts incidental flow of the underfill material 134 beyond the marginsof the active component 124, across the solder mask 112, and stopping ator near the edge of the fluid flow barrier 132. By “underfill material”,it is understood that an encapsulation material such as a polymer isused. The application of a flowable encapsulation material is notintended to be restricted to the underfill process. It is applicable toany process of applying an encapsulation material to a microelectronicdevice as it is being packaged with a local fluid flow barrier accordingto the various embodiments set forth in this disclosure.

In FIG. 1, the underfill material 134 is depicted as having formed aconvex meniscus 136 at the lip that is formed in the solder mask 112 bythe recess 132 that is the fluid flow barrier 132 embodiment depicted inFIG. 1. In an embodiment, surface tension in the underfill material 134is such that as it encounters the fluid flow barrier 132, significantresistance to further flow occurs at the edge of the recess 132,sufficient for enough time for the underfill material 134 to ceaseflowing. Consequent to this embodiment, the fluid flow barrier 132 isintegral with the solder mask 112.

FIG. 1 also depicts a raised portion 138 of the solder mask 112 that isbetween the fluid flow barrier 132 and the location of the passivecomponent bond pad 118.

Although the floor 120 of the recess 132 is depicted as including anexposed portion of the electrical layer 114, it is understood thatpatterning of the electrical layer 114 can include a dielectric floor ofthe recess with only the substrate 110 exposed as the floor thereof.

FIG. 2 is a selective plan view of the microstrip mounting substratedepicted in FIG. 1 according to an embodiment. The section line 1-1illustrates the view taken from FIG. 1. The mounting substrate 112includes a passive component site 140 and an active component site 142.The active component site 142 is depicted as an organic land grid array(OLGA) that includes a plurality of active component bond pads 116, oneof which is labeled. The passive component site 140 is depicted as anOLGA that includes a plurality of passive component bond pads 118, oneof which is labeled. The passive component site 140 is also depicted asa perimeter 140 around a given plurality of passive component bond pads118 for a single passive component. The raised portion 138 of the soldermask 112 also delineates a perimeter around the plurality of passivecomponent bond pads 118 for a single passive component. Accordingly inan embodiment, the fluid flow barrier for a given passive component site140 is disposed local only to that passive component site 140.

FIG. 2 also depicts the spaced-apart distance between the perimeters ofthe passive component site 140 and the active component site 142. In anembodiment, the distance 144 between the perimeters of the passivecomponent site 140 and the active component site 142 is in a range fromabout 5 millimeter (mm) to about 1 mm. In an embodiment, the distance144 is in a range from about 1.5 mm to about 4 mm. In an embodiment, thedistance 144 is in a range from about 2 mm to about 3 mm. In anembodiment, the distance 144 is about 1.7 mm.

FIG. 3 is a cross-section of a package 300 that includes a fluid flowbarrier on a stripline mounting substrate according to an embodiment. Amounting substrate 310 for a stripline board includes a substrate cover311 that covers an electrical layer 314. In the stripline board, anelectrical ground layer 315 is disposed above the electrical layer 314and is exposed in selected sites with a solder mask 312. In anembodiment, the electrical layer 314 includes a copper layer that hasbeen patterned to include an active component bond pad 316. Theelectrical layer 314 can also include a passive component bond pad 318.The electrical ground layer 315 can include exposed conductive materialthat acts as a floor 320 in a fluid flow barrier according to anembodiment. Additionally, the electrical layer 314 can include traces322, one of which is indicated in FIG. 3.

In an embodiment for a chip package, an active component 324, such as aprocessor or a memory chip, is bonded to the active component bond pad316 through a bump 326 according to an embodiment. The bump 326 isdepicted as a solder ball, but other electrical connections can be usedaccording to the specific application. Other electrical connectionsinclude bond wires bonded to the active component bond pad 316, leadfingers, pins, and others. According to an embodiment, the fluid flowbarrier 332 is coupled to the active component 324 by virtue of itsphysical disposition in relation thereto.

The an embodiment for a chip package, a passive component 328, such as acapacitor, an inductor, a resistor, or another passive component, isbonded to the passive component bond pad 318 through a bump 330according to an embodiment. The bump 330 is depicted as a lead finger,but other electrical connections can be used according to the specificapplication. Other electrical connections include bond wires bonded tothe passive component bond pad 318, solder balls, pins, and others.Similarly, according to an embodiment, the fluid flow barrier 332 iscoupled to the passive component 328 by virtue of its physicaldisposition in relation thereto.

FIG. 3 also depicts the fluid flow barrier 332, depicted in FIG. 3 as arecess; 332 in the solder mask 312. The fluid flow barrier 332 can alsobe a dam according to an embodiment. The fluid flow barrier 332 can alsobe a recess in dam according to an embodiment. In any event, the fluidflow barrier 332 is disposed local to the passive component 328, andconsequently local to the passive component site as set forth in thisdisclosure. An example of the local disposition of the fluid flowbarrier 332 is set forth in FIG. 2 as item 132 and elsewhere in thisdisclosure.

FIG. 3 also depicts an underfill material 334 that is depicted as havingfilled the space between the active component 324 and the mountingsubstrate 310 to insulate and protect the bump 326. FIG. 3 also depictsincidental flow of the underfill material 334 beyond the margins of theactive component 324, across the solder mask 312, and stopping at ornear the edge of the fluid flow barrier 332. In FIG. 3, the underfillmaterial 334 is depicted as having formed a convex meniscus 336 at thelip that is formed in the solder mask 312 by the recess 332 that is thefluid flow barrier 332 embodiment depicted in FIG. 3. In an embodiment,surface tension in the underfill material 334 is such that as itencounters the fluid flow barrier 332, significant resistance to furtherflow occurs at the edge of the recess 332, sufficient for enough timefor the underfill material 334 to cease flowing. Consequent to thisembodiment, the fluid flow barrier 332 is integral with the solder mask312.

FIG. 3 also depicts a raised portion 338 of the solder mask 312 that isbetween the fluid flow barrier 332 and the location of the passivecomponent bond pad 318.

Although the floor 320 of the recess 332 is depicted as including anexposed portion of the electrical ground layer 315, it is understoodthat patterning of the electrical ground layer 315 can include a floorof the recess 320 with only the substrate cover 311 exposed as the floorthereof.

FIG. 4 is a plan of a passive component site 140 detail taken from FIG.3, along the dashed line 4-4 according to an embodiment. The fluid flowbarrier 132 is depicted at the perimeter with the floor 120 that in anembodiment is an exposed portion of the electrical layer 114.Consequently, the fluid flow barrier 132 is local to the passivecomponent site 140. Additionally, the raised portion 138 of the soldermask 112 is depicted between the passive component bond pad 118 and thefluid flow barrier 132.

FIG. 5 is a plan of a passive component site 540 according to anembodiment. The passive component site 540 is similar in locatability tothe passive component site 140 depicted in FIGS. 2 and 4. A fluid flowbarrier 532 is depicted at the perimeter with a floor 520 that in anembodiment is an exposed portion of an electrical layer such as theelectrical layer 114 depicted in FIG. 1. Consequently, the fluid flowbarrier 532 is local to the passive component site 540. In anembodiment, the floor 520 exposes a substrate (not pictured). In anembodiment, the floor 520 exposes an electrical ground layer.Additionally, a raised portion 538 of the solder mask 512 is depictedbetween a passive component bond pad 518 and the fluid flow barrier 532.

FIG. 5 depicts a non-linear boundary 546 of the passive component site540. The non-linear boundary 546 includes a boundary that is situated todivert flow of underfill material 534. Diversion of flow of underfillmaterial 534 includes situating the non-linear boundary 546 such that aflow front 548 of underflow material 534 encounters the non-linearboundary 546 of the fluid flow barrier 532 at a non-orthogonal angle, asindicated by the directional arrows 550. In an embodiment, thenon-linear boundary 546 is a composite of rectilinear segments 546.

In an embodiment, the non-linear boundary 546 includes two surfaces thatare set at an obtuse but interior angle with respect to each other. Inan embodiment, the angle is about 179°. In an embodiment, the angle isin a range from about 179° to about 150°. In an embodiment, the angle isin a range from about 150° to about 120°. In an embodiment, the angle isin a range from about 120° to about 91°. In an embodiment, the angle isan acute angle.

FIG. 6 is a plan of a passive component site 640 according to anembodiment. The passive component site 640 is similar in locatability tothe passive component site 540 depicted in FIG. 5. A fluid flow barrier632 is depicted at the perimeter with a floor 620 that in an embodimentis an exposed portion of an electrical layer such as the electricallayer 114 depicted in FIG. 1. Consequently, the fluid flow barrier 632is local to the passive component site 640. In an embodiment, the floor620 exposes a substrate (not pictured). In an embodiment, the floor 620exposes an electrical ground layer. Additionally, a raised portion 638of the solder mask 612 is depicted between a passive component bond pad618 and the fluid flow barrier 632.

FIG. 6 depicts a non-linear boundary of the passive component site 640.The non-linear boundary includes a boundary that is situated to divertflow of underfill material 634. Diversion of flow of underfill material634 includes situating the non-linear boundary such that a flow front648 of underflow material 634 encounters the non-linear boundary of thefluid flow barrier 632 at a non-orthogonal angle, as indicated by thedirectional arrows 650. In an embodiment, the non-linear boundary is acomposite of rectilinear segments 646 and curvilinear segments 647.

In an embodiment, the non-linear boundary includes two surfaces 646 thatare set at an obtuse but interior angle with respect to each other. Inan embodiment, the angle is about 179°. In an embodiment, the angle isin a range from about 179° to about 150°. In an embodiment, the angle isin a range from about 150° to about 120°. In an embodiment, the angle isin a range from about 120° to about 91°.

FIG. 7 is a plan of a mounting substrate 700 that includes an activecomponent site 742 and a plurality of passive component sites accordingto an embodiment. Of the passive components sites, one is depicted withreference number 740. The passive component site 740 includes a fluidflow barrier 732 that is local thereto. In an embodiment, the passivecomponent site 740 is depicted with a non-linear boundary 746 that facesthe active component site 742. Accordingly, the non-linear boundary 746is situated to divert flow of underfill material by a non-orthogonalencounter of the underfill material with a non-linear boundary 746 asset forth in this disclosure. In an embodiment, the mounting substrate700 includes a corner passive component site 752 that is substantiallyrectangular with no actual non-linear boundaries. The corner passivecomponent site 752, however, has effective non-linear boundaries as flowof underfill material will encounter the two closest boundaries 746′ ata non-orthogonal flow angle relative thereto.

FIG. 8 is a plan of a mounting substrate 800 that includes an activecomponent site 842 and a plurality of passive component sites accordingto an embodiment. Of the passive components sites, one is depicted withreference number 840. The passive component site 840 includes a fluidflow barrier 832 that is local thereto. In an embodiment, the passivecomponent site 840 is depicted with a non-linear boundary 846 that facesthe active component site 842. Accordingly, the non-linear boundary 846is situated to divert flow of underfill material by a non-orthogonalencounter of the underfill material with a non-linear boundary 846 asset forth in this disclosure. In an embodiment, the mounting substrate800 includes a corner passive component site 852 that is substantiallyrectangular with no actual non-linear boundaries. The corner passivecomponent site 852, however, has effective non-linear boundaries as flowof underfill material will encounter the two closest boundaries 846′ ata non-orthogonal flow angle relative thereto.

The mounting substrate 800 also includes a fluid flow barrier 854 thatcontrols flow of underfill material generally. In an embodiment, thefluid flow barrier 854 is a recess such as the fluid flow barrier 132depicted in FIG. 1. The fluid flow barrier 854 can also be a damaccording to an embodiment. The fluid flow barrier 854 can also be arecess in dam according to an embodiment. In any event, the fluid flowbarrier 854 is disposed generally with respect to the passive componentsites 840.

FIG. 9 is a perspective cut-away of a computing system 900 that includesthe local fluid flow barrier according to an embodiment. One or more ofthe foregoing embodiments of a structure that exhibits local control ofunderfill material during flow application may be utilized in acomputing system, such as a computing system 900 of FIG. 9. Thecomputing system 900 includes at least one processor (not pictured),which is enclosed in a package 910, a data storage system 912, at leastone input device such as keyboard 914, and at least one output devicesuch as monitor 916, for example. The computing system 900 includes aprocessor that processes data signals, and may include, for example, amicroprocessor, available from Intel Corporation. In addition to thekeyboard 914, the computing system 900 can include another user inputdevice such as a mouse 918, for example.

For purposes of this disclosure, a computing system 900 embodyingcomponents in accordance with the claimed subject matter may include anysystem that utilizes a microelectronic device system, which may include,for example, a local fluid flow barrier that is coupled to data storagesuch as dynamic random access memory (DRAM), polymer memory, flashmemory, and phase-change memory. In this embodiment, the local fluidflow barrier is coupled to any combination of these functionalities bybeing coupled to a processor. In an embodiment, however, a local fluidflow barrier set forth in this disclosure is coupled to any of thesefunctionalities. For an example embodiment, data storage includes anembedded DRAM cache on a die. Additionally in an embodiment, the localfluid flow barrier that is coupled to the processor (not pictured) ispart of the system with a local fluid flow barrier that is coupled tothe data storage of the DRAM cache. Additionally in an embodiment, alocal fluid flow barrier is coupled to the data storage 912.

In an embodiment, the computing system can also include a die thatcontains a digital signal processor (DSP), a micro controller, anapplication specific integrated circuit (ASIC), or a microprocessor. Inthis embodiment, the local fluid flow barrier is coupled to anycombination of these functionalities by being coupled to a processor.For an example embodiment, a DSP (not pictured) is part of a chipsetthat may include a stand-alone processor (in package 910) and the DSP asseparate parts of the chipset. In this embodiment, a local fluid flowbarrier is coupled to the DSP, and a separate local fluid flow barriermay be present that is coupled to the processor in package 910.Additionally in an embodiment, a local fluid flow barrier is coupled toa DSP that is mounted on the same board as the package 910.

It can now be appreciated that embodiments set forth in this disclosurecan be applied to devices and apparatuses other than a traditionalcomputer. For example, a die can be packaged with an embodiment of thelocal fluid flow barrier, and placed in a portable device such as awireless communicator or a hand-held device such as a personal dataassistant and the like. Another example is a die that can be packagedwith an embodiment of the local fluid flow barrier and placed in avehicle such as an automobile, a locomotive, a watercraft, an aircraft,or a spacecraft.

FIG. 10 is a method flow diagram that depicts a packaging method 1000according to an embodiment. The method flow includes forming a mountingsubstrate. The method flow can also include assembling a chip package.

At 1010, the method includes forming an active component site and apassive component site in a substrate. In a non-limiting example, themethod includes patterning an electrical layer 114 in a microstrip board100 as depicted in FIG. 1.

At 1020, the method includes forming a fluid flow barrier that is localto the passive component site. In a non-limiting example, the methodincludes patterning the solder mask 112 that covers the electrical layer114 as depicted in FIG. 1.

At 1030, the method includes assembling an active component at theactive component site and a passive component at the passive componentsite. In a non-limiting example, the method includes assembling thepassive component 128 and the active component 124 to the mountingsubstrate 110 with the recess 132 therebetween.

At 1040, the method includes underfilling the active component withunderfill material, under conditions that cause the underfill materialto stop at or before the fluid flow barrier that is local to the passivecomponent site. In a non-limiting example, the method includes flowingencapsulation material under conditions that cause the underfillmaterial to terminate at or before it encounters the local fluid flowbarrier.

It is emphasized that the Abstract is provided to comply with 37 C.F.R.§1.72(b) requiring an Abstract that will allow the reader to quicklyascertain the nature and gist of the technical disclosure. It issubmitted with the understanding that it will not be used to interpretor limit the scope or meaning of the claims.

In the foregoing Detailed Description, various features are groupedtogether in a single embodiment for the purpose of streamlining thedisclosure. This method of disclosure is not to be interpreted asreflecting an intention that the claimed embodiments of the inventionrequire more features than are expressly recited in each claim. Rather,as the following claims reflect, inventive subject matter lies in lessthan all features of a single disclosed embodiment. Thus the followingclaims are hereby incorporated into the Detailed Description ofEmbodiments of the Invention, with each claim standing on its own as aseparate preferred embodiment.

It will be readily understood to those skilled in the art that variousother changes in the details, material, and arrangements of the partsand method stages which have been described and illustrated in order toexplain the nature of various embodiments of this invention may be madewithout departing from the principles and scope thereof as expressed inthe subjoined claims.

1-20. (canceled)
 21. A method comprising: forming an active componentsite and a passive component site in a substrate, wherein the activecomponent site and the passive component site are spaced apart; andforming a fluid flow barrier local to the passive component site andspaced apart from the active component site, the fluid flow barrierforming an obtuse angle directed against the active component site. 22.The method of claim 21, further including: installing an activecomponent at the active component site; installing a passive componentat the passive component site; and forming an encapsulation structurecontiguous the active component and extending away therefrom.
 23. Themethod of claim 21, wherein forming an encapsulation structure includesflowing encapsulation material under conditions that cause theencapsulation material to terminate at the fluid flow barrier.
 24. Themethod of claim 21, wherein forming an encapsulation structure includesflowing encapsulation material under conditions that cause theencapsulation material to terminate in a convex meniscus profile at thefluid flow barrier.
 25. The method of claim 21, wherein forming a fluidflow barrier local to the passive component site includes forming thefluid flow barrier perimeter to divert flow of the encapsulationmaterial.
 26. The method of claim 21, wherein forming an encapsulationstructure includes flowing encapsulation material under conditions thatcause the encapsulation material to terminate in a convex meniscusprofile at the fluid flow barrier, and wherein forming a fluid flowbarrier local to the passive component site includes forming the fluidflow barrier perimeter to divert flow of the encapsulation material. 27.The method of claim 21, wherein the passive component site and theactive component site are disposed in a solder mask on the first side,wherein the fluid flow barrier is a trench in the solder mask, whereinthe trench describes a perimeter around the passive component site,wherein the perimeter includes a trench side that is adjacent and spacedapart from the active component site, wherein the trench side that isadjacent and spaced apart from the active component site includes aboundary and wherein forming an encapsulation structure includes flowingencapsulation material under conditions that cause the encapsulationmaterial to terminate at the fluid flow barrier.
 28. The method of claim21, wherein the passive component site and the active component site aredisposed in a solder mask on the first side, wherein the fluid flowbarrier is a trench in the solder mask, wherein the trench describes aperimeter around the passive component site, wherein the perimeterincludes a trench side that is adjacent and spaced apart from the activecomponent site, wherein the trench side that is adjacent and spacedapart from the active component site includes a non-linear boundary, andwherein the non-linear boundary is selected from curvilinear,rectilinear, and combinations thereof, and wherein forming anencapsulation structure includes flowing encapsulation material underconditions that cause the encapsulation material to terminate at thefluid flow barrier, and wherein forming a fluid flow barrier local tothe passive component site includes forming the fluid flow barrierperimeter to divert flow of the encapsulation material.